Item | Capability | Remarks |
---|---|---|
Board Dimension (min) | 5mm X 5mm | |
Board Dimension (max) | 300mm X 300mm | |
Material | FR2,FR4,CEM1 & Metal Clad | Other materials available on request |
Layers | 1, 2 | 4,6,8 layers available on request |
Copper Weight | 1oz(35mm) , 2oz(70mm) | +/- 10% |
Min trace Width & Spacing | 0.3mm | |
Annular Rings | 0.2mm | |
Spacing between Trace & Copper Pour | 0.3mm | |
Circuit to Edge | 0.3mm | |
Silk & Solder Pad (min) | 0.2mm | |
Minimum Drill Hole | 0.3mm | |
Silkscreen height/width | Height 0.5mm Width 0.2mm |